The Huawei Ascend P7 is the latest smartphone from the Chinese company in the Ascend series but this hasn’t deterred spec details about the upcoming Ascend P8 smartphone and a January 2015 release date is massively tipped.
With the details trickling out of China, the Huawei Ascend P8 is expected to have a metal body with a ceramic (porcelain texture) back cover. The device is expected to pack a 5.2-inch 1080p touchscreen display with a 2.5D curved glass display.
The HiSilicon Kirin 930 SoC is expected to power the device though it is still currently in production test phase. The Kirin 930 SoC is manufactured using TSMC’s 16nm process and is said to be an octa-core processor with its exact clock speed unknown.
We’ll keep updating more information when we more details surface about the Ascend P8. No matter what material is used on the Huawei Ascend P8, the pricing is tipped to be around CNY 2,999 (~ $489 or €392) and is expected to be at least announced at the CES 2015 in January (2015).
