Late in May, Mediatek unveiled its first 5G SoC for high-end 5G devices at the Computex 2019 in Taipei, Taiwan. The Mediatek 5G SoC is manufactured using the 7nm FinFET process and comes built-in with the Mediatek Helio M70 5G multi-mode modem for primarily 5G connectivity (4.7Gbps download & 2.5Gbps upload speeds) but also supports other cellular connectivity from 2G to 4G.
The 5G SoC is based on ARM’s latest Cortex-A77 CPU and Mali-G77 GPU but uses Mediatek’s APU 3.0 (AI Processing Unit) to match the right performance required to deliver extreme user experiences and super-fast 5G connectivity. The chipset also supports super-high-resolution camera (up to 80MP), 4K video encoding and decoding at 60 frames per second (fps) and both LTE and 5G dual connectivity (EN-DC) with dynamic power sharing capability.
Mediatek is expected to release more features and details of the 5G SoC in coming months. The new chipset will arrive in commercial devices by Q1 2020 but manufacturers and interested stakeholders will begin testing customer samples by Q3 2019. Commenting at the launch event, MediaTek President Joe Chen said;
“Everything about this chip is designed for the first wave of flagship 5G devices. The leading-edge technology in this chipset makes it the most powerful 5G SoC announced to date and puts MediaTek at the forefront of 5G SoC design. MediaTek will power rollouts of 5G premium level devices.
“The industry, OEMs and consumers have high expectations for 5G. We are confident devices powered by MediaTek’s 5G chipset, with its impressive architecture, leading imaging features, powerful AI and ultra-fast 5G speeds, will deliver incredible experiences”.
Source: MediaTek Newsroom
