MediaTek has announced two new 6nm chipsets – the Dimensity 1200 and Dimensity 1100, to power the next wave of 5G smartphones. Both chipsets, manufactured using TSMC 6nm process, feature Cortex-A78 cores in an octa-core CPU configuration alongside ARM Mali-G77 MC9 GPU, 5-Core ISP, MediaTek APU 3.0 AI processor, MediaTek MiraVision HDR10+ Video Playback & AV1 Hardware Decoding, and MediaTek HyperEngine 3.0 gaming technology and an integrated 5G modem with MediaTek’s 5G UltraSave technology for 5G (SA/NSA) and True Dual SIM 5G.
The MediaTek Dimensity 1200 has a 1 + 3 + 4 CPU arrangement featuring a single ultra Cortex-A78 core clocked up to 3.0GHz, four super Cortex-A78 cores clocked at 2.6GHz and four power-efficient Cortex-A55 cores clocked at 2.0GHz. It supports up to 200MP single camera, Dual Channel UFS 3.1 storage, 4ch LPDDR4x (up to 4266Mbps), FHD+ display at 168Hz, Wi-Fi 6, and Bluetooth 5.2.
The MediaTek Dimensity 1100, on the other hand, has an octa-core CPU in a 4+4 arrangement, which is made up of four super Cortex-A78 cores clocked at 2.6GHz and four power-efficient Cortex-A55 cores clocked at 2.0GHz. It supports up to 108MP single camera, 32MP + 16MP dual cameras, and FHD+ display at 144Hz. Companies such as realme, OPPO, Vivo and Xiaomi are expected to release smartphones based on the new Dimensity chips by the end of Q1 and starting Q2 2021.
Source: MediaTek Newsroom
