As the race to equip mobile devices with 5G continues, Mediatek has unveiled its new Dimensity 820 octa-core SoC to deliver premium-level user experience to mid-tier devices. This new chipset is designed to support global sub-6GHz 5G networks in Asia, North America and Europe, and will make its debut on the upcoming Redmi 10X smartphone series set to be announced on May 26.
Earlier this week, Qualcomm set the tone with the launch of the Snapdragon 768G for similar range of devices. The MediaTek Dimensity 820 is basically the overclocked version of the Dimensity 800 and graphics has also been upgraded. It is manufactured using the same 7nm TSMC process and the four high-performance ARM Cortex-A76 cores are now clocked higher at 2.6GHz (compared to 2.0GHz on the MediaTek Dimensity 800).
The other four Cortex-A55 core @2.0GHz remain the same. The SoC is equipped with the ARM Mali-G57 MC5 GPU (an extra core added to the Mali-G57 MC4 on the Dimensity 800) and combines with the HyperEngine 2.0 to deliver immersive gaming experience. It integrates the 5G NR (sub-6GHz) modem, MediaTek’s AI processing unit (APU 3.0) and Imaqiq 5.0. It also supports Dual 5G SIM, Dual Standby and Voice Over New Radio (VONR) on both SIMs.
Source: MediaTek Newsroom
