Just in time for the launch of Qualcomm’s new 6nm-manufactured Snapdragon 7785G 5G mobile platform, MediaTek also unveiled its own Dimensity 900 5G Chipset based on the same TSMC manufacturing process. It is expected to deliver a blend of 5G connectivity, Artificial Intelligence (AI), imaging innovations and multimedia to commercial devices starting Q2 2021.
The MediaTek Dimensity 900 has a 64-bit octa-core GPU configuration with 2x ARM Cortex-A78 cores clocked up to 2.4GHz and 6x ARM Cortex-A55 cores clocked up to 2GHz. It supports LPDDR4X/ LPDDR5 memory, UFS 2.2/ UFS 3.1 storage, 120Hz screen refresh rate, FHD+ screen resolution, 3rd-gen MediaTek AI processing, up to 108MP single camera/20MP + 20MP dual cameras, 4K HDR Video capture and MediaTek’s HyperEngine gaming engine.
For 5G connectivity, the chipset has a 5G New Radio (NR) sub-6GHz modem with carrier aggregation (5G-CA) and support for bandwidth up to 120MHz. It also offers dual-SIM 5G standby, 5G SA/NSA networking, dual-SIM VoNR voice services, Wi-Fi 6 with 2×2 MIMO, Bluetooth 5.2, and GNSS (L1+L2). It integrates the ARM Mali-G68 GPU, which has all the features of the bigger Mali-G88 but arrives in a compact design better optimized for power efficiency as well as extended battery life.
