Mediatek has released two new ‘Helio P series’ mobile chipsets – the Helio P23 and Helio P30. Both SoCs, built on the TSMC 16nm FinFET production process, are built to deliver dual SIM and dual 4G VoLTE capabilities, dual camera photography, and performance and power efficiency to mid-range smartphones.
The Mediatek Helio P23 is the world’s first chip with dual SIM, dual VoLTE / ViLTE support, providing a faster and more stable connectivity experience for dual SIM card users. The Mediatek Helio P30 adds a new Vision Processing Unit (VPU), which pairs a dedicated 500MHz digital signal processor to the Image Signal Processor (ISP) to free up resources and delivers a number of other advantages like performance boost and huge power reduction.
Powered by Mediatek’s CorePilot technology (v4.0), the Helio P23 and Helio P30 pack eight Cortex-A53 cores clocked up to 2.3GHz paired with ARM Mali-G71 MP2 (P23 in the 770MHz and P30 in the 950MHz). The former features support for 13MP + 13MP dual camera setups while the latter supports 16MP + 16MP.
The MediaTek Helio P23 will be available globally in the Q4 of 2017 while the Mediatek Helio P30 will be available at first in China around the same time.
Source: Mediatek
