Mediatek has announced its latest flagship chipset in the Helio P series – the Mediatek Helio P90. It is based on the same 12nm TSMC FinFET techn employed on the Helio P60 and Helio P70 but integrates APU 2.0 which generates an incredible 1127GMACs: 4.6x more than the P60 and P70.
The Mediatek Helio P90 is not quite as powerful as Huawei‘s Kirin 980, Qualcomm’s Snapdragon 855 and Samsung’s Exynos 9820, but it is also optimised for advanced artificial intelligence (AI) and connectivity, battery life, high-res smartphone photography and gaming.
It houses an octa-core CPU which contains a cluster of 2x Cortex A75 cores clocked at 2.2GHz and 6x Cortex A55 cores clocked at 2.0GHz, paired with PowerVR GM 9446 clocked up to 970MHz. It supports up to 2-channel LPDDR4x 8GB RAM, UFS 2.1 storage, GNSS (Beidou, Galileo, GLONASS & GPS), dual VoLTE, 4G LTE Worldmode, 2×2 802.11ac and Bluetooth 5.0.
The chipset supports up to a 48MP single camera or 24MP + 16MP dual cameras, single or dual camera bokeh (DoF) and 21:9 full-screen displays at Full HD+ (2520 x 1080) resolution. It also supports AI experiences such as human pose detection, deep-learning facial detection, object and scene identification, artificial reality (AR) and mixed reality (MR) acceleration and more.
Based on MediaTek’s NeuroPilot SDK, developers and OEMs can create innovative AI applications using common frameworks such as TensorFlow, TF Lite, Caffe and Caffe2. The Mediatek Helio P90 is expected to arrive in consumer mobile devices starting Q1 2019.
