Last week, Qualcomm announced the latest addition to the Snapdragon 600 Series of Mobile Platforms – the Qualcomm Snapdragon 670. The new SoC is engineered to deliver cutting-edge technologies to mainstream smartphones in the areas of performance, camera capabilities and AI tech.
The Qualcomm Snapdragon 670 Mobile Platform – successor to last year’s Snapdragon 660 – is built using the power-efficient 10nm LPP process technology. It features 8x Kryo 360 CPU core, the Snapdragon X12 LTE modem, Adreno 615 GPU, Hexagon 685 DSP and Spectra 250 ISP.
Compared to the previous generation (Snapdragon 660), the SDM670 renders graphics 25% faster, the Kryo CPU delivers up to 15 percent higher performance and Qualcomm’s multi-core Qualcomm Artificial Intelligence (AI) Engine delivers up to 1.8x AI performance.
It supports Qualcomm Quick Charge 4+, Bluetooth 5.0, display resolutions up to Full HD+, up to 16 MP dual cameras and up to 25 MP single cameras. The Qualcomm Snapdragon 670 mobile platform will start appearing in commercial devices for release later this year.
Source: Qualcomm Newsroom
