Qualcomm Technologies has released the official features and specs of its next-gen flagship processor (mobile platform) – the Qualcomm Snapdragon 845 Mobile Platform at its 2nd annual Snapdragon Technology Summit in Hawaii. The platform will power devices such as smartphones, XR headsets and always connected PCS expected to arrive starting first half of 2018.
As opposed to the Snapdragon 835 which focuses on speed and performance, the Snapdragon 845 is designed to deliver immersive multimedia experience, lightning-fast connectivity, vault-like security and on-device Artificial Intelligence (AI) on premium, flagship mobile devices.
The Qualcomm Snapdragon 845 Mobile Platform is built using Samsung’s 10nm LPP FinFET process technology and features the new Kryo 385 architecture. The CPU eight Kyro 385 cores’ includes 4x Cortex-A75 cores up to 2.8 GHz + 4x Cortex-A55 cores up to 1.8 GHz, which sees a 25% uplift in performance.
The new Adreno 630 visual processing subsystem (GPU, VPU and DPU) promises up to 30-percent faster graphics and 30-percent better power efficiency when compared to previous generation (Adreno 540). It also features 2.5x faster display throughput i.e a 2K x 2K display can efficiently run at 120 Hz.
In the aspect of connectivity, the SDM845 is equipped with the Snapdragon X20 LTE modem to deliver Gigabit LTE service (up to 1.2 Gbps peak download speeds and up to 150 Mbps peak upload speed). It also supports Bluetooth 5.0, Dual SIM Dual VoLTE, 802.11ad multi-gigabit Wi-Fi and integrated 2×2 802.11ac.
Other key components include the new Hexagon 685 DSP (3x faster than the previous generation – Hexagon 682) which serves as the AI mobile co-processor, Qualcomm Aqstic audio codec and Qualcomm Spectra 280 ISP for premium camera and extended reality (XR) experience.
The company has also introduced an entirely new Qualcomm Secure Processing Unit (SPU) to help protect personal data with vault-like security. Some variant of Samsung’s upcoming Galaxy S9/S9+ are expected to be powered by th SDM845 and Xiaomi has also confirmed that its next flagship – possibly the Xiaomi Mi 7 – will have the SoC onboard.
Source: Qualcomm Press Release
