It is very rare to find a flagship Huawei smartphone being powered by the company’s HiSilicon Kirin SoC not to talk of some of the midrange ones. An upcoming chipset in the HiSilicon Kirin family – the Huawei Kirin 950 SoC.
The chinese company along with Qualcomm, Samsung and Mediatek, all have their various portfolio of chipset. At the moment, only Huawei and Samsung manufacture devices whilst also making their own processor too.
Huawei is said to be collaborating with TSMC to manufacture the HiSilicon Kirin 950 SoC which would be built using a 16nm process and would be able to tough it out with the upcoming Qualcomm Snapdragon 820 processor.
The Huawei HiSilicon Kirin 950 processor is a 64-bit octa-core chipset which has four Cortex-A53 cores and another Cortex-A72 cores with both clocking up to 2.4GHz. It has the ARM Mali-T880 GPU for graphics, support for LPDDR4 RAM, UFS 2.0, eMMC 5.1 storage, and supports up to 42MP cameras.
The Kirin 950 has an i7 co-processor which will handle security, connectivity and Sensor hub. It supports LTE Cat.10, has Bluetooth 4.2, Wi-Fi, USB 3.0 and NFC.
Even though there is no official word yet, Huawei is expected to release the chipset by the third or the fourth quarter of this year. At the moment, the top range chipset from Huawei is the Kirin 935 SoC which is used in the Huawei Honor 7. The company is expected to release the chipset probably along with a smartphone by Q3 or Q4 of this year.
In addition, the Huawei HiSilicon Kirin 950 has been previously linked with the Huawei Ascend D8 (Huawei D8) which was leaked in a supposed roadmap from the company. Out of the device listed on the roadmap, only the Huawei P8 (Huawei Ascend P8) has gone official.
